청구기호 |
TK7876-7876.42 |
판사항 |
1st ed. 1998.
|
형태사항 |
XII, 158 p. online resource.
|
총서명 |
Electronic Packaging and Interconnects, 1389-2169 ; 1
|
언어 |
English |
내용 |
1: Electronic Packaging and High Frequencies -- 1.1 Packaging and high-frequency effects -- 1.2 Overview of the book chapters -- References -- 2: Electrical Description of Electronic Packaging -- 2.1 Introduction -- 2.2 Circuit descriptions -- 2.3 Qualitative characteristics -- 2.4 Conclusions -- References -- 3: High-Frequency Measurement Techniques -- 3.1 Introduction -- 3.2 Frequency-domain instruments -- 3.3 Time-domain network analyzer -- 3.4 Comparison of frequency- and time-domain network analyzers -- 3.5 Error correction -- 3.6 Conclusion -- References Appendix 3.A: Spatial resolution of the TDR/T-technique -- 4: High-Frequency Measurement Techniques for Electronic Packaging -- 4.1 Introduction -- 4.2 General test fixtures -- 4.3 Dedicated test fixtures with coaxial-planar transitions -- 4.4 On-board probing -- 4.5 Comparison of the coaxial-planar and coplanar probe transitions -- 4.6 De-embedding -- 4.7 Measuring 2N-port structures with two-port instruments -- 4.8 Conclusion -- References -- 5: Measurement-Based Modeling Algorithms -- 5.1 Introduction -- 5.2 One-port components -- 5.3 Transmission lines -- 5.4 General interconnections and packaging -- 5.5 Conclusions -- References.
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주제 |
Microwaves.
Optical engineering.
Control engineering.
Robotics.
Mechatronics.
Electrical engineering.
Microwaves, RF and Optical Engineering. --https://scigraph.springernature.com/ontologies/product-market-codes/T24019
Control, Robotics, Mechatronics. --https://scigraph.springernature.com/ontologies/product-market-codes/T19000
Electrical Engineering. --https://scigraph.springernature.com/ontologies/product-market-codes/T24000
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보유판 및 특별호 저록 |
Springer Nature eBook
Printed edition: 9781461556244
Printed edition: 9781461375739
Printed edition: 9780792383079
|
ISBN |
9781461556237 |
기타 표준번호 |
10.1007/978-1-4615-5623-7 |
QR CODE |
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