| 청구기호 |
QD131 |
| 형태사항 |
1 online resource.
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| 총서명 |
Woodhead publishing series in electronic and optical materials ; 88
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| 언어 |
English |
| 서지주기 |
Includes bibliographical references and index.
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| 내용 |
Front Cover; Materials Characterization Using Nondestructive Evaluation (NDE) Methods#; Related titles; Materials Characterization Using Nondestructive Evaluation (NDE) Methods; Copyright; Contents; List of contributors; Woodhead Publishing Series in Electronic and Optical Materials; 1 -- Atomic force microscopy (AFM) for materials characterization; 1.1 Introduction; 1.2 Comparison of AFM with other microscopy techniques; 1.3 Principles of AFM technique; 1.4 Construction and basic components of AFM; 1.5 Working modes of AFM; 1.5.1 Contact mode; 1.5.2 Noncontact mode; 1.5.3 Tapping mode
1.6 Application of AFM for material characterization1.6.1 Surface properties measurement; 1.6.2 AFM measurements for hardness and modulus measurements; 1.6.3 AFM measurements for damage characterizations; 1.6.4 AFM measurements for characterizations of surface treatment effects; 1.7 Conclusions; Acknowledgments; References; 2 -- Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) for materials characterization; 2.1 Introduction; 2.2 Why electron microscopy?; 2.2.1 Key advantages of imaging with electrons; 2.2.2 Key disadvantages of imaging with electrons
2.3 Types of microscopes2.4 Interaction of electrons with materials; 2.4.1 Elastic versus inelastic electron scattering; 2.4.2 Signals from the specimen; 2.5 What material features can we analyze using electron microscopy?; 2.5.1 Practical electron microscopy; 2.6 Scanning electron microscopy; 2.6.1 Key features of the SEM microscope; 2.6.2 Specimen preparation; 2.6.3 SEM detectors; 2.7 Key microstructural features analyzed by SEM; 2.7.1 Specimen shape; 2.7.2 Specimen composition; 2.7.3 Surface crystallography; 2.8 Transmission electron microscopy; 2.8.1 Key features of the TEM microscope
2.8.2 TEM specimen preparation2.9 TEM imaging modes; 2.10 TEM spectroscopy; 2.10.1 X-ray analysis in TEM (EDX); 2.10.2 Electron energy loss spectrometry; 2.11 Key applications of TEM; 2.12 Is electron microscopy a nondestructive technique?; 2.12.1 Specimen preparation; 2.12.2 Specimen changes during imaging; 2.12.3 Strategies for minimizing specimen damage; 2.13 Outlook for SEM and TEM; References; 3 -- X-ray microtomography for materials characterization; 3.1 Introduction; 3.2 Imaging physics; 3.2.1 X-ray microfocus tubes; 3.2.2 Interaction of hard X-rays with materials
3.2.2.1 X-ray attenuationPhoton absorption; Compton scattering; 3.2.2.2 Phase contrast imaging; 3.2.3 X-ray detectors and imaging devices: principles, features, and common systems; 3.3 Principles of microcomputed tomography; 3.4 Geometrical considerations and data acquisition; 3.5 System design (CT methods); 3.6 Image reconstruction; 3.7 Image quality; 3.8 Radiation exposure; 3.9 Examples of important and/or frequent applications for materials characterization; 3.10 Conclusions and future trends; 3.11 Further literature; References
4 -- X-ray diffraction (XRD) techniques for materials characterization
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| 주제 |
Materials --Analysis.
TECHNOLOGY & ENGINEERING / Metallurgy --bisacsh
Materials --Analysis. --fast --(OCoLC)fst01011773
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| 보유판 및 특별호 저록 |
Print version: Huebschen, Gerhard Materials Characterization Using Nondestructive Evaluation (NDE) Methods : Elsevier Science,c2016 9780081000403
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| ISBN |
9780081000571, 008100057X, 9780081000403
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| QR CODE |
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